The dual in-line package is characterized by easy perforation soldering of printed circuit boards and good compatibility with circuit boards. However, due to the gradual high-density interconnection of electronic devices, the limited number of pins in the DIP package cannot achieve small-scale high-density integration. Now, DIP has slowly faded out of people’s field of vision.
Spacing:
The internationally accepted DIP package JEDEC standard has a pitch of 2.54 mm between two pins. The DIP package used in some Eastern European countries is slightly different from the JEDEC standard, and its pitch is metric 2.5mm. The distance between the two rows of pins depends on the number of pins. Other less common distances are: 1.78 mm, 7.62 mm, 15.24 mm, 10.16 mm or 22.86 mm.
Number of needles:
The number of pins in a DIP package is always an even number. Common DIP pin counts are 8, 14, 16, 18, 20, 24, 28, 32 or 40, 48. Of course, there are also 52- or 64-pin packages, which are the maximum pin counts commonly used in DIP packages today.
Orientation and Pin Numbers:
When the identification notch of the DIP component is facing up, the first pin on the upper left is pin 1, and the other pins in the same row are sorted in anti-clockwise order. Jumping to the opposite row of pins after going to the bottom is to sort from bottom to top.
Take the DIP18 integrated circuit as an example: when the identification notch is facing up, the pins on the left are 1-9 pins from top to bottom, and the pins on the right are 10-18 pins from bottom to top.
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